DMOS Transistor with a cavity that lies below the drift region

ABSTRACT

A lateral DMOS transistor formed on a silicon-on-insulator (SOI) structure has a higher breakdown voltage that results from a cavity that is formed in the bulk region of the SOI structure. The cavity exposes a portion of the bottom surface of the insulator layer of the SOI structure that lies directly vertically below the drift region of the DMOS transistor.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to DMOS transistors and, moreparticularly, to a DMOS transistor with a cavity that lies below thedrift region.

2. Description of the Related Art

A metal-oxide-semiconductor (MOS) transistor is a well-known device thathas heavily-doped source and drain semiconductor regions which areseparated by a lightly-doped channel semiconductor region of theopposite conductive type. The MOS transistor also has an oxide layerthat lies over the channel semiconductor region, and a metal gate thattouches the oxide layer and lies over the channel semiconductor region.In addition to metal, the gate of a MOS transistor is also commonlyformed with doped polysilicon.

A double-diffused MOS (DMOS) transistor is a power transistor that has alarge lightly-doped drain semiconductor region, known as a drift region,which touches the channel semiconductor region and typically liesbetween the channel semiconductor region and the heavily-doped drainsemiconductor region. DMOS transistors are commonly formed as verticaldevices where the source and drain regions are vertically spaced apart,and as lateral devices where the source and drain regions arehorizontally spaced apart.

In operation, vertical DMOS transistors typically provide betterperformance (e.g., a lower on-state drain-to-source resistance) thanlateral DMOS transistors. Lateral DMOS transistors, however, are usuallymuch easier to fabricate and, therefore, are less expensive to producethan vertical DMOS transistors.

FIG. 1 shows a cross-sectional diagram that illustrates an example of aconventional lateral DMOS transistor 100. As shown in FIG. 1, DMOStransistor 100 includes a silicon-on-insulator (SOI) structure 102 thatincludes a bulk region 104, an insulator layer 106 approximately 0.4 μmthick that covers the top surface of bulk region 104, and asingle-crystal semiconductor region 108 approximately 0.8 μm thick thattouches the top surface of insulator layer 106.

In addition, SOI structure 102 includes a trench isolation structure TOXthat extends through single-crystal semiconductor region 108 to touchinsulator layer 106 and form a number of isolated regions ofsingle-crystal semiconductor region 108. (Only one isolated region ofsingle-crystal semiconductor region 108 is shown for clarity.)

As further shown in FIG. 1, single-crystal semiconductor region 108includes a p-type well 110 that touches insulator layer 106, a p− bodyregion 112 that touches p-type well (and sets the threshold voltage ofDMOS transistor 100), and an n− drift region 114 that touches insulatorlayer 106, p-type well 110, and p− body region 112.

Single-crystal semiconductor region 108 additionally includes an n+drain region 120 that touches n− drift region 114 and lies spaced apartfrom p− body region 112, an n+ source region 122 that touches p− bodyregion 112 and lies spaced apart from n− drift region 114, and a p+contact region 124 that touches p− body region 112. Thus, n− driftregion 114 touches a doped region that includes p-type well 110, p− bodyregion 112, and p+ contact region 124. Also, a channel region 126 of p−body region 112 lies horizontally between and touches n− drift region114 and n+ source region 122.

As additionally shown in FIG. 1, lateral DMOS transistor 100 furtherincludes a gate oxide layer 130 that touches p− body region 112 overchannel region 126, and a gate 132 that touches gate oxide layer 130over channel region 126. Gate 132 can be implemented with metal or dopedpolysilicon.

In operation, a first positive voltage is placed on n+ drain region 120and a second positive voltage is placed on gate 132, while ground isplaced on n+ source region 122 and p+ contact region 124. In response tothese bias conditions, the channel region 126 of p− body region 112inverts, and electrons flow from n+ source region 122 to n+ drain region120.

One important characteristic of a DMOS transistor is the breakdownvoltage BVdss of the transistor, which is the maximum off-state voltagewhich can be placed on n+ drain region 120 before the drift region114-to-body region 112 junction breaks down, or insulator layer 106breaks down, whichever is lower. Since DMOS transistors are powertransistors, there is a need to handle larger voltages and, thereby, aneed to increase the breakdown voltage BVdss of the transistor.

U.S. Pat. No. 6,703,684 to Udrea et al teaches that the breakdownvoltage BVdss of a lateral DMOS transistor can be increased by removingthe portion of bulk region 104 that lies below the DMOS transistor. FIG.2 shows a cross-sectional diagram that illustrates an example of aconventional Udrea DMOS transistor 200.

Udrea DMOS transistor 200 is similar to DMOS transistor 100 and, as aresult, utilizes the same reference numerals to designate the structuresthat are common to both DMOS transistors. As shown in FIG. 2, Udrea DMOStransistor 200 differs from DMOS transistor 100 in that Udrea DMOStransistor 200 has a backside opening 210 that extends through bulkregion 104 to expose the portion of insulator layer 106 that lies belowDMOS transistor 200.

However, although Udrea transistor 200 increases the breakdown voltageBVdss of the transistor, backside trench etching significantlycomplicates the process flow, requires thick SOI wafers for the etch tostop on, and may require large capital outlays to purchase the equipmentrequired for the process flow.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional diagram illustrating an example of aconventional lateral DMOS transistor 100.

FIG. 2 is a cross-sectional diagram illustrating an example of aconventional Udrea DMOS transistor 200.

FIG. 3 is a cross-sectional diagram illustrating an example of a DMOStransistor 300 in accordance with the present invention.

FIG. 4 is a graph further illustrating the operation of DMOS transistor300 in accordance with the present invention.

FIGS. 5A-5C through 19A-19C are views illustrating a method of forming aDMOS transistor in accordance with the present invention. FIGS. 5A-19Aare plan views. FIGS. 5B-19B are cross-sectional views taken along lines5B-5B through 19B-19B of FIGS. 5A-19A. FIGS. 5C-19C are cross-sectionalviews taken along lines 5C-5C through 19C-19C of FIGS. 5A-19A.

FIG. 20 is a cross-sectional diagram illustrating an example of a DMOStransistor 2000 in accordance with an alternate embodiment of thepresent invention.

FIGS. 21A-21B are graphs further illustrating the operation of DMOStransistor 2000 in accordance with the present invention.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 3 shows a cross-sectional diagram that illustrates an example of aDMOS transistor 300 in accordance with the present invention. Asdescribed in greater detail below, the breakdown voltage BVdss of DMOStransistor 300 is increased by forming a cavity in the bulk region of anSOI structure.

DMOS transistor 300 is similar to DMOS transistor 100 and, as a result,utilizes the same reference numerals to designate the structures whichare common to both transistors. As shown in FIG. 3, DMOS transistor 300differs from DMOS transistor 100 in that DMOS transistor 300 has acavity 310 in bulk region 104 that exposes a portion of the bottomsurface of insulator layer 106. The portion of the bottom surface ofinsulator layer 106, in turn, lies directly vertically below n− driftregion 114.

Cavity 310 is a single region that has a depth D and, in the FIG. 3example, a portion that lies directly vertically beneath a portion ofgate 132. Alternately, no portion of cavity 310 can lie directlyvertically below any portion of gate 132. As described, DMOS transistor300 includes a lateral pn diode (p− body region 112 and n− drift region114) and a vertically isolated field plate.

DMOS transistor 300 operates the same as DMOS transistor 100, exceptthat when a voltage is applied to n+ drain region 120, the verticalcomponent of the electric field across insulator layer 106 induces aspace charge depletion region across n− drift region 114 and insulatorlayer 106 as a result of the RESURF (REducedSURfaceField) principlewhich, in turn, lowers the lateral electric field. The lowered lateralelectric field increases the breakdown voltage BVdss of DMOS transistor300 which, in turn, allows DMOS transistor 300 to operate with higherdrain voltage levels.

FIG. 4 shows a graph that further illustrates the operation of DMOStransistor 300 in accordance with the present invention. The graphcompares a simulated breakdown voltage BVdss versus the depth D ofcavity 310 of DMOS transistor 300. As shown in FIG. 4, with the correctdepth D of cavity 310, a breakdown voltage BVdss in excess of 700V canbe realized.

In addition, FIG. 4 also illustrates the relationship between theon-state drain-to-source resistance r_(DS(ON)) of DMOS transistor 300and the depth D of cavity 310. As further shown in FIG. 4, the on-statedrain-to-source resistance r_(DS(ON)) rises generally linearly as thedepth D of cavity 310 increases. DMOS transistors are power transistorsand, as a result, can pass large currents when turned on. As a result, alow on-state drain-to-source resistance r_(DS(ON)) of the transistor isan important factor.

Further, silicon, oxide, and air (in cavity 310) have very differentdielectric constants (e.g., 11.9, 3.9, and 1.0, respectively). The lowerthe value, the more electric field lines are drawn to that region.However, as the depth D of cavity 310 increases, fewer electric fieldlines can be drawn to the region. The lower the dielectric constant, thebetter it is for this effect.

When the depth D of cavity 310 is very large, the potential lines freelyspread into cavity 310, and the thickness of insulator layer 106 nolonger limits the breakdown voltage BVdss. As a result, the doping of n−drift region 114 should be greatly reduced when the depth D of cavity310 is very large.

In the FIG. 4 example, a DMOS transistor with a breakdown voltage BVdssin excess of 700V and a low on-state drain-to-source resistancer_(DS(ON)) can be realized (with insulator layer 106 approximately 0.4μm thick and semiconductor region 108 approximately 0.8 μm thick) whencavity 310 has a depth D of approximately 1.5 μm.

FIGS. 5A-5C through 19A-19C show views that illustrate a method offorming a DMOS transistor in accordance with the present invention.FIGS. 5A-19A are plan views, while FIGS. 5B-19B are cross-sectionalviews taken along lines 5B-5B through 19B-19B of FIGS. 5A-19A, and FIGS.5C-19C are cross-sectional views taken along lines 5C-5C through 19C-19Cof FIGS. 5A-19A.

As shown in FIGS. 5A-5C, the method utilizes a conventionally-formed SOIwafer 502 that includes a bulk region 504 approximately 750 μm thick, aninsulator layer 506 approximately 0.4 μm thick that covers the topsurface of bulk region 504, and a single-crystal semiconductor region510 approximately 0.45 μm thick that touches the top surface ofinsulator layer 506.

In addition, SOI wafer 502 includes a trench isolation structure TOXthat extends through single-crystal semiconductor region 510 to touchinsulator layer 506 and form a number of isolated regions ofsingle-crystal semiconductor region 510. (Only one isolated region ofsingle-crystal semiconductor region 510 is shown for clarity.)

As further shown in FIGS. 5A-5C, the method begins by depositing a layerof pad oxide 512 onto single-crystal semiconductor region 510, such asby low-pressure chemical vapor deposition (LPCVD), followed by thedeposition of a layer of silicon nitride 514 onto pad oxide layer 512by, for example, LPCVD.

After this, a patterned photoresist layer 516 is formed on the topsurface of silicon nitride layer 514. Patterned photoresist layer 516 isformed in a conventional manner, which includes depositing a layer ofphotoresist, and projecting a light through a patterned black/clearglass plate known as a mask to form a patterned image on the layer ofphotoresist. The light softens the photoresist regions exposed to thelight. Following this, the softened photoresist regions are removed.

As shown in FIGS. 6A-6C, after patterned photoresist layer 516 has beenformed, the exposed regions of silicon nitride layer 514 and pad oxidelayer 512 are anisotropically etched in a conventional manner to exposeregions on the surface of single-crystal semiconductor region 510, andthereby form a patterned hard mask 520. Thus, patterned hard mask 520has a pattern that is defined by the etch of silicon nitride layer 514and pad oxide layer 512. After the etch, patterned photoresist layer 516is removed in a conventional manner.

As shown in FIGS. 7A-7C, after hard mask 520 has been formed, theexposed regions of single-crystal semiconductor region 510 and insulatorlayer 506 are anisotropically dry etched to form a number of openings522 that each expose the top surface of bulk region 504. The openings522 can extend through regions of single-crystal semiconductor region510 that will subsequently be implanted to form a lightly-doped driftregion, and thereby act as lateral RESURF regions, or a heavily-dopedregion. The openings 522 can alternately be formed through trenchisolation structure TOX.

Next, as shown in FIGS. 8A-8C, SOI wafer 502 is oxidized to form anoxide layer 524 on the silicon surfaces exposed by the etch. Followingthis, a layer of silicon nitride is conventionally deposited. Thesilicon nitride layer and oxide layer 524 are then anisotropicallyetched back in a conventional manner to expose the top surface of bulkregion 504, and form side wall spacers 526 that line the side walls ofthe openings 522.

As shown in FIGS. 9A-9C, after the side wall spacers 526 have beenformed, SOI wafer 502 is wet etched in a conventional manner with anetchant that is selective to silicon to form a cavity 530 in bulk region504. In addition, the bottom surface of cavity 530 between adjacentopenings 522 has peaks 532 that result from using a wet isotropic etch.The density of the openings 522 should be placed so as to minimize theheight of the peaks 532.

As additionally shown in FIG. 9B, cavity 530 extends under a transistorportion 534 of single-crystal semiconductor region 510 and theunderlying portion of insulator layer 506. Once cavity 530 has beenformed, silicon nitride layer 514 and the nitride portion of the sidewall spacers 526 are removed with a conventional process.

Following the removal of silicon nitride layer 514 and the nitrideportion of the side wall spacers 526, as shown in FIGS. 10A-10C, a layerof capping oxide 536 is deposited on pad oxide layer 512 by, forexample, chemical vapor deposition. As further shown in FIGS. 10A-10C,capping oxide layer 536 covers, but does not fill, the openings 522.

Next, as shown in FIGS. 11A-11C, SOI wafer 502 is planarized in aconventional manner to remove pad oxide layer 512 and the portions ofcapping oxide layer 536 that lie above the top surface of single-crystalsemiconductor region 510 to expose the top surface of single-crystalsemiconductor region 510.

For example, a planarizing material can first be deposited on cappingoxide layer 536 to form a flat surface. After this, SOI wafer 502 can bewet etched with an etchant that etches the planarizing material and theoxide (capping oxide layer 536 and pad oxide layer 512) at substantiallythe same rate. The etch continues until the top surface ofsingle-crystal semiconductor region 510 has been exposed.

Chemical-mechanical polishing can alternately be used to remove an upperportion of the oxide, but is unlikely to be used to expose the topsurface of single-crystal semiconductor region 510 unlesschemical-mechanical polishing can be performed without damaging the topsurface of single-crystal semiconductor region 510.

In addition, as further shown in FIGS. 11A-11C, the planarization formsoxide plugs 540. Following the planarization and the exposure of the topsurface of single-crystal semiconductor region 510, as shown in FIGS.12A-12C, a p-type dopant, such as boron, is blanket implanted into thetop surface of single-crystal semiconductor region 510 to set the dopantconcentration of a to-be-formed p-type well region. The blanket implantcan alternately be performed before SOI wafer 502 is planarized.

Next, as shown in FIGS. 13A-13C, a non-conductive layer 542, such as agate oxide, is formed on the top surface of single-crystal semiconductorregion 510. Following the formation of non-conductive layer 542, apolysilicon layer 544 is formed to touch gate oxide layer 542.

Once polysilicon layer 544 has been formed, polysilicon layer 544 isdoped using, for example, an n-type blanket implant with a dose of1.79×10¹⁶ atoms/cm³ and an implant energy of 30 KeV. After this, apatterned photoresist layer 546 is formed on polysilicon layer 544 in aconventional manner.

Next, as shown in FIGS. 14A-14C, the exposed regions of polysiliconlayer 544 are etched away in a conventional manner to form a gate 550.Patterned photoresist layer 546 is then removed using conventionalsteps. After this, as shown in FIGS. 15A-15C, a patterned photoresistlayer 552 is formed over single-crystal semiconductor region 510 in aconventional manner.

Next, an n-type dopant, such as phosphorous, is implanted into the topsurface of single-crystal semiconductor region 510 to form an n− driftregion 554 and, thereby, also form a p-type well region 556. Forexample, n− drift region 554 can have a dopant concentration ofapproximately 1×10¹⁶ atoms/cm³, and a length of approximately 30-50 μm.Doping decreases as the depth D of cavity 530 increases.

N− drift region 554 can alternately be formed to have a graded dopantconcentration by using multiple patterned photoresist layers. Forexample, the region of n− drift region 554 closest to gate 550 can havea dopant concentration of approximately 8×10¹⁵ atoms/cm³ that increaseslinearly to approximately 3×10¹⁶ atoms/cm³ in the region that liesfurthest from gate 550. Patterned photoresist layer 552 is then removedin a conventional manner.

Following the removal of patterned photoresist layer 552, as shown inFIGS. 16A-16C, a patterned photoresist layer 560 is formed oversingle-crystal semiconductor region 510 in a conventional manner. Next,an n-type dopant, such as arsenic, is implanted into the top surface ofsingle-crystal semiconductor region 510 to form an n+source region 562and an n+ drain region 564. For example, the n+ source and drain regions562 and 564 can have a dopant concentration of 1×10¹⁸ atoms/cm³.Patterned photoresist layer 560 is then removed in a conventionalmanner.

Following the removal of patterned photoresist layer 560, as shown inFIGS. 17A-17C, a patterned photoresist layer 566 is formed oversingle-crystal semiconductor region 510 in a conventional manner. Next,a p-type dopant, such as boron, is implanted into the top surface ofsingle-crystal semiconductor region 510 at an angle to form a p− bodyregion 568. The implant sets the threshold voltage of the to-be-formedDMOS transistor. Patterned photoresist layer 566 is then removed in aconventional manner.

Following the removal of patterned photoresist layer 566, as shown inFIGS. 18A-18C, a patterned photoresist layer 569 is formed oversingle-crystal semiconductor region 510 in a conventional manner. Next,a p-type dopant, such as boron, is implanted into the top surface ofsingle-crystal semiconductor region 510 to form a p+ contact region 570that touches p− body region 568. For example, p+ contact region 570 canhave a dopant concentration of 1×10¹⁸ atoms/cm³.

Thus, n− drift region 554 touches a doped region that includes p-typewell region 556, p− body region 568, and p+ contact region 570. Also, achannel region 572 of p− body region 568 lies horizontally between andtouches n− drift region 554 and n+ source region 562. (Additionalvertical p-type implants can be made, such as to form a deep p-typeregion in p− body region 568 that lies below n+ source region 562 and p+contact region 570, in the same manner described above, i.e., form mask,implant, remove mask, to further tailor the p-type region.)

Following this, as shown in FIGS. 19A-19C, patterned photoresist layer569 is removed in a conventional manner. A conventional rapid thermalprocess is used to drive in and activate the implants. (The implants canalternately be driven in and activated multiple times, such as aftereach implant.) Once the implants have been driven in and activated, themethod continues with conventional back end processing steps to completethe formation of the DMOS transistor.

Thus, a method of forming a lateral DMOS transistor with a cavity 530 ina SOI wafer 502 has been disclosed. The method forms the cavity 530 byselectively etching a number of openings through the single-crystalsemiconductor region 510 and the insulator layer 506 to expose acorresponding number of regions on bulk region 504 of the SOI wafer 502.

The method also forms a number of side wall spacers to touch the sidewalls of the number of openings 522, and wet etches bulk region 504through the number of openings 522 to form a single cavity 530 that liesbelow each of the openings 522. Once the cavity 530 has been formed, themethod also forms a number of plugs 540 that plug the openings 522.

FIG. 20 shows a cross-sectional diagram that illustrates an example of aDMOS transistor 2000 in accordance with the present invention. DMOStransistor 2000 is similar to DMOS transistor 300 and, as a result,utilizes the same reference numerals to designate the structures whichare common to both transistors.

As shown in FIG. 20, DMOS transistor 2000 differs from DMOS transistor300 in that DMOS transistor 2000 utilizes an n− drift region 2010 inlieu of n− drift region 114. N− drift region 2010, in turn, is thinnerthan n− drift region 114, thereby allowing a portion of p-type wellregion 110 to lie below n− drift region 2010.

In addition, cavity 310 is also shorter such that the edge of cavity 310that lies closest to gate 132 is horizontally spaced apart from avertical line that lies coincident with the edge of gate 132 that liesclosest to cavity 310 by a horizontal separation distance X_(SON). Inthis case, cavity 310 lies directly vertically below less than all ofdrift region 2010.

DMOS transistor 2000 operates the same as DMOS transistor 300, exceptthat the depletion region across the junction between n− drift region2010 and the portion of p-type well region 110 that lies below n− driftregion 2010 substantially covers n− drift region 114, along with aportion of p-type well region 110 that lies below n− drift region 114.

DMOS transistor 2000 can be formed by implanting single-crystalsemiconductor region 510 with a p-type dopant to have a dopantconcentration of approximately 2.5×10¹⁵ atoms/cm³, and then growing ann-type epitaxial layer on the top surface of single-crystalsemiconductor region 510 before the trench isolation region TOX isformed.

In addition, fewer openings 522 are formed to shorten the length ofcavity 530 when bulk region 504 is wet etched. Also, when n− driftregion 2010 is subsequently formed, n− drift region 2010 is formed witha lower implant energy to have a dopant concentration of approximately3.0×10¹⁵ atoms/cm³.

FIGS. 21A and 21B show graphs that further illustrates the operation ofDMOS transistor 2000 in accordance with the present invention. The graphin FIG. 21A compares the simulated breakdown voltage BVdss versus thedepth D of cavity 310 of DMOS transistor 2000. As shown in FIG. 21A,with the correct depth D of cavity 310, a breakdown voltage BVdss ofapproximately 600V can be realized.

The graph in FIG. 21B compares the simulated breakdown voltage BVdssversus the horizontal separation distance X_(SON) (measured between theedge of gate 132 and the edge of cavity 310. As shown in FIG. 21B, thehighest breakdown voltage can be realized when a small horizontalseparation exists between the edge of gate 132 and the edge of cavity310.

In the FIG. 20 example, a DMOS transistor with a breakdown voltage BVdssof approximately 600V can be realized (with an insulator layer 106approximately 1.0 μm thick, an n− drift region 2010 approximately 2.25μm thick, and a p-type well region 110 directly below n− drift region2010 approximately 2.2 μm thick when cavity 310 has a depth D ofapproximately 14 μm. Thus, although DMOS transistor 2000 has a slightlylower breakdown voltage BVdss than DMOS transistor 300, the depth D ofcavity 310 in DMOS transistor 2000 is substantially larger.

It should be understood that the above descriptions are examples of thepresent invention, and that various alternatives of the inventiondescribed herein may be employed in practicing the invention. Thus, itis intended that the following claims define the scope of the inventionand that structures and methods within the scope of these claims andtheir equivalents be covered thereby.

What is claimed is:
 1. A method of forming a DMOS transistor comprising:providing a silicon-on-insulator (SOI) structure which includes a bulkregion having a top surface; an insulator layer that touches the topsurface of the bulk region, the insulator layer having a top surface anda bottom surface; and a single-crystal semiconductor region whichincludes: forming a doped body region, of a first conductivity type thattouches the insulator layer, and a drift region of a second conductivitytype that touches the insulator layer; forming a trench isolationstructure that extends through the single-crystal region to touch theinsulator layer forming a plurality of isolated regions ofsingle-crystal semiconductor region; depositing a layer of pad oxideonto the single-crystal semiconductor region, followed by depositing asilicon nitride layer onto the pad oxide layer; forming a patternedphotoresist layer on the top surface of the silicon nitride layer toform exposed regions on the silicon nitride layer; forming a hard maskby using the patterned photoresist layer as a mask to etch the exposedregions on the silicon nitride layer and the pad oxide layer to resultin the formation of exposed regions on the surface of the single-crystalsemiconductor region; using the hard mask, selectively etching theexposed regions on the surface of the single-crystal semiconductorregion to form a plurality of openings through the single-crystalsemiconductor region and the insulator layer, and thereby exposing acorresponding plurality of regions on the top surface of the bulk regionof the silicon-on-insulator (SOI) structure, the plurality of openingshaving a plurality of side walls; forming a plurality of side wallspacers that touch the plurality of side walls of the plurality ofopenings; wet etching the bulk region through the plurality of openingsto form a single cavity that lies below each of the plurality ofopenings; wherein the single cavity exposes a portion of the bottomsurface of the insulator layer, the portion of the bottom surface of theinsulator layer lying directly vertically below the drift region;forming a capping oxide layer that covers, but does not fill theplurality of openings; and planarizing the top surface of thesilicon-on-insulator (SOI) structure to remove the pad oxide layer andportions of the capping oxide layer until the top surface of thesingle-crystal semiconductor region is exposed.
 2. The method of claim 1and further comprising forming a plurality of non-conductive plugs thatplug the plurality of openings.
 3. The method of claim 1 and furthercomprising forming the doped body region of a first conductivity typeand the drift region of a second conductivity type, the doped regiontouching the insulator layer, the drift region touching the doped bodyregion.
 4. The method of claim 3 wherein the cavity lies directly belowall of the drift region.
 5. The method of claim 3 wherein the cavitylies directly below less than all of the drift region.
 6. The method ofclaim 3 and further comprising forming source and drain regions of thesecond conductivity type, the source region touching the doped bodyregion and being spaced apart from the drift region, the drain regiontouching the drift region and being spaced apart from the doped bodyregion.